CAPABILITY

ITEM

Capability

Month Capability

3000 types/month,20000sqm/month

Board Material

FR4, Aluminium, Copper; Polyimide ,Rogers ,Taconic, Isola 

Surface treatment

OSP, HASL, Lead free HASL, ENIG(immersion Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers, Plating flash gold, ENEPIG

PCB types

Rigid FR4 PCB, HDI PCB, High Frequency PCB such as Rogers ,Taconic, Isola PCB,MCPCB, Flexible PCB, Rigd-flexible PCB

Thickness Tolerance

1.0mm: +/-0.1mm ; 1.0mm-2.0mm: +/-10%;  >2.0mm:  +/-8%

PTH: +/-3mil; NPTH:+/-2mil

Outline Tolerance including V-cut by CNC: <100mm: +/-0.1mm;  100mm-300mm: +/-0.15mm;  >300mm: +/-0.2mm

Holes Capacability

Final hole size:Min 0.2mm; Drilling hole size: 0.20~6.5mm;Drilling tolerance; +/-0.05mm;

Final hole size tolerance (PTH): φ0.20~1.60mm+/-0.075mm,φ1.60~6.30mm: +/-0.10mm;

Final hole size tolerance (NPTH):φ0.20~1.60mm+/-0.05mm, φ1.60~6.50mm: +/-0.05mm;

Drilling strip hole: Length /width 2:1, Min strip hole width 0.65mm, Length & width tolerance +/-0.05mm;

Board thickness/hole size: ≤ 10:1

Technical Specification

Min line width/space: 3/3mil

Min via:0.15mm (mechanical drilling);  0.1mm (laser drilling)

Max copper thickness: 14 oz

Max board size: single layer including FR4based PCB and MCPCB: 600mmx1500mm,Multi-layers:500x1200mm

Board thickness: single or double layers: 0.2-7.0mm;   Multi-layers: 0.4-7.0mm

Min solder mask bridge: min 0.08mm

Aspect Ration: 15:1

Plugging Vias capability: 0.2-0.8mm

Au, NI thickness control:

1.     Chem gold: Au:1-10u”

2.     gold fingers: Au:1-150u”

3.     flash gold: Au:1-10u”

4.     hard gold:Au:1-150u”

5.     Ni thickness:50-1000u”

6.     ENEPIG: Au:1-8u”,Pd:2-5u”